Gary Hilson

The Universal Flash Storage (UFS) specification was, from its inception, meant to be road-worthy. Expected to overtake embedded MultiMediaCard (eMMC) in automotive applications, UFS has become the preferred non-volatile storage medium of choice for…

The idea of baking security into an application isn’t new in the software world, nor are security features in semiconductor technologies, such as memory. But the value of data, particularly in artificial-intelligence (AI) workloads, means…

The memory industry has always gone through a predictable boom-and-bust cycle, but the pandemic and geopolitical instability has introduced new twists to the market over the course of 2022, and uncertainty will continue to play a role in 2023. In…

The Compute Express Link (CXL) spec is arguably one of the fastest-maturing interfaces in the semiconductor industry. Its widespread buy-in has meant many vendors have designed products to build out the ecosystem, with the Storage Networking Industry…

Emerging memories are entering a new phase, but without a high-profile phase-change memory (PCM) that was responsible for the segment’s growth in previous years. Intel announced it was sunsetting Optane, its PCM-based 3D XPoint technology, just as…

A decade ago, a flash-based solid-state drive (SSD) was pricey and precious—reserved for “hot data” that needed fast access, all the while keeping track of how many writes the storage media could handle before it wore out. Today, the endurance of…

Nothing says enduring like a technology that’s weathered mergers and acquisitions. Infineon Technologies’ latest iteration of its HyperRAM expansion memory can trace its roots back to Spansion, which merged with Cypress Semiconductor in late 2014.…

The remote-work era spawned by the pandemic shone a light on the need for robust security when endpoints exponentially proliferate and workloads become more distributed. Nvidia’s latest data processing unit (DPU) reflects that these…

The embedded MultiMediaCard (eMMC) standard is no longer being updated. But that’s not keeping some vendors from innovating around the NAND flash storage device for use cases where it’s still the best option. While Universal Flash Storage (UFS) was…

Picking the right processor for the job may soon be a simpler decision for many design engineers, even in high–performance computing (HPC), data analytics, 5G network processing, and artificial–intelligence and machine–learning operations. Rather…

The sixth iteration of the Peripheral Component Interconnect (PCIe) specification only came out at the beginning of the year, but the organization responsible for shepherding it is already looking ahead to PCIe 7.0. During the PCI–SIG Developers…

The journey to Level 5 autonomy is taking longer than initially expected, but Micron Technology is opting to be well prepared so that any memory content meets tomorrow’s reliability requirements today. Micron announced that its LPDDR5 memory is now…

Western Digital Corp.’s (WD) latest batch of new storage products is a reminder that hard drive technology isn’t going anywhere as customers of all sizes grapple with exponential data growth and raise their performance expectations of storage media.…

As interest in artificial intelligence (AI) and in-memory computing significantly increases, resistive random-access memory (ReRAM) could be the key to unlocking their ability to imitate the human brain — yet challenges remain. Last year’s IEDM…

To meet the bandwidth demands of rapidly advancing automotive and artificial intelligence (AI) and machine learning (ML) workloads, companies such as Rambus are beginning to change where Peripheral Component Interconnect Express (PCIe) interconnects…

High bandwidth memory (HBM) is becoming more mainstream. With the latest iteration’s specifications approved, vendors in the ecosystem are gearing to make sure it can be implemented so customers can begin to design, test and deploy systems. click for…

Weebit Nano of Israel and French research institute CEA-Leti report advances in the development of resistive-RAM (ReRAM) techology, although few are ready for prime time. CEA-Leti’s advance involves what it calls a “newfangled approach” that enables…

The rapid emergence of the Compute Express Link (CXL) specification is an excellent example of heterogenous computing — but not all heterogenous computing is necessarily CXL. Rather, it’s about connecting to whatever mix of compute, memory, and…

The ability to hot swap storage media from servers or consumer electronics is taken for granted. A new standard is aimed making it easier to change out flash memory that’s typically been soldered into connected devices and embedded applications. The…

The memory specifications game often boils down to getting more performance while keeping power consumption low. This is particular true for Low Power Double Data Rate (LPDDR) DRAM but uses cases such as artificial intelligence (AI), edge computing…