Nick Flaherty

Two new JEDEC standards are aiming to help developers use silicon carbide (SiC) switches. The standards from the JEDEC...

Dovetail Electric Aviation’s system includes electric motors and battery packs as well as, alternatively, hydrogen fuel cells or a...

Enhancing EV safety is not all about physical safety aspects. Functional safety is a crucial element of EV design intended to prevent...

Controlling industrial equipment via a natural language voice interface is a growing challenge being addressed by edge AI and tool developers

High-reliability connectors support EVs and rail systems with robust power delivery, high-speed data transmission and resistance to vibration.

The global semiconductor market has officially topped one trillion dollars, four years early and is steaming towards two trillion.

Nivalis Energy Europe has developed a solar-powered system and an e-axle system for refrigerated trucks to keep...

Three commercial rollouts in September are showing how the robotaxi is making its way further into everyday life.

Power Integrations has developed a gallium nitride (GaN) technology that operates up to 2200 V for high-power...

The distribution market is facing its biggest challenge in a generation with the AI datacentre boom, consolidation and and sharp price rises

AI, of course, dominated the recent Hot Chips conference in California, with processors for inference, data centres and even desktops

A recent independent survey for UK connector maker Harwin has highlighted some key trends for both Europe and North America.

The IFA exhibition in Berlin, Germany, later this week is dominated by AI being added to almost every class of consumer electronics.

One of the key advantages of RISC-V is the ability to add custom instructions to make a system more secure or boost performance in edge AI

A new phase in PQC is underway, with the field of candidate digital signature algorithms narrowing as AI systems begin to expose weaknesses

The autumn of 2026 is set to see significant changes in AI inference with new chips, new boxes and a key edge AI acquisition

The evolution of AI is seeing the advent of a new generation of accelerators that change the balance of Arm embedded systems.

Extreme ultraviolet (EUV) systems, volumetric printing and 2D materials are all advancing for semiconductor structures under 1nm

Researchers in the UK have developed a conductive adhesive that can be easily removed for recycling. The team at the University...

Infineon Technologies has developed a 1300 V silicon carbide (SiC) power module that is the first to operate at a temperature of 205 C...