Ross connects developers' preferred LLMs to AMD's Vivado and Vitis HLS toolchains through open-standard MCP servers.

The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.

The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of the company’s AI SoCs.

The DF150 is the first in the company's Defiant Future series, targeting defense and industrial applications with MIL-STD certifications and fanless operation down to -46°C.

National Semiconductor packed four single-supply comparators into one cheap package and created one of the most widely used analog ICs ever made.

The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.

The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.

The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while Snapdragon Sound Elite Gen 2 targets camera-equipped AI wearables.

The modular power platform integrates DC-DC conversion and EMI filtering in a single qualified assembly rated from -55°C to 110°C, with no derating, suitable for military and space applications.

The modular power platform integrates DC-DC conversion and EMI filtering in a single qualified assembly rated from -55°C to 110°C, with no derating, suitable for military and space applications.

The L9962 integrates cell monitoring, balancing, protection, and a 3.3-V LDO in a 7 mm x 7 mm package and draws just 2 uA in deep sleep.

In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple programming interface created the hobbyist MCU scene.

The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U rack-mount instrument.

AOS pairs its aMOS E2 high-voltage MOSFET platform with the top-side cooled GTPAK package, targeting power supplies, solar inverters, and industrial systems.

New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive compliance testing, and advanced AI semiconductor testing.

The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.

The RP50-AW and RP100-FW series pair ultra-wide input-voltage flexibility with compact footprints and operating temperatures up to 110°C.

The new device pairs Triaxis Hall sensing with analog sine and cosine outputs in a 2.0 mm x 2.5 mm package aimed at through-shaft and side-of-shaft actuators.

The automotive-grade EcoIGBT lineup pairs a 1.55-V saturation voltage with a 7-µs short-circuit withstand time. It comprises 12 discrete parts and 10 bare wafer products.

National Semiconductor reduced the analog bar-graph display to a single IC, a handful of LEDs, and one resistor. The level meter was never the same.